SEAKR Selected As Pit Boss Prime For DARPA’s Blackjack Program Advanced Space Processing

SEAKR Selected As Pit Boss Prime For DARPA’s Blackjack Program Advanced Space Processing News provided by SEAKR Engineering, Inc. Apr 28, 2020, 09:00 ET CENTENNIAL, Colo., April 28, 2020 /PRNewswire/ — SEAKR® Engineering, Inc. (SEAKR) is pleased to announce it has been awarded as the prime contractor for Defense Advanced Research Projects Agency (DARPA) Pit…

SEAKR Recognized in ColoradoBiz Magazine as a 2020 Made in Colorado: Top Manufacturer

SEAKR is please to announce, it has been recognized in ColoradoBiz Magazine’s: Made in Colorado 2020: The Top 100 Manufacturers List.  We are proud to call Colorado our home, and to be part of a group of forward-thinking companies making and manufacturing products in Colorado.  We extend a sincere congratulations to all companies recognized in the 2020 list,…

SEAKR is one of 15 vendors working on DARPA’s Blackjack constellation

SEAKR is honored to be mentioned by SpaceNews as on of 15 vendors helping the U.S. Defense Advanced Research Projects Agency (DARPA) in providing concepts for state-of-the-art advanced space processing to strengthen U.S. military satellite communications.  DARPA’s big bet on Blackjack by Sandra Erwin — January 8, 2020 SpaceNews illustration/Adobe stock The U.S. Defense Advanced Research Projects Agency…

SEAKR’s Annual Chili Cook-Off Yields Some Amazing Culinary Feats!

Alongside Engineering, our employees build and craft incredible culinary feats. Recently, employees joined together for SEAKR’s annual chili cook-off, putting their skills to the test. A special note of thanks to Matthew Starnes and William Deines who helped managed the contest and judging. In tandem, thanks goes out to all our talented chefs—what a delicious…

SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications

  SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications Glasswing™ SerDes Enables Chiplet Integration in a Shared MCM Package Without Requiring an Interposer Email Print Friendly Share October 30, 2019 07:00 ET | Source: Kandou Bus LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) — Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has…